Advanced Multiphysics Methods for 3-D Integrated Circuits
Reporter:
Dr. Liu Na, School of Electronic Science and Technology, Xiamen University
Inviter:
Yifa Tang, Professor
Subject:
Advanced Multiphysics Methods for 3-D Integrated Circuits
Time and place:
15:00-16:00 November 8(Tuesday), N702
Abstract:
In recent years, integrated circuit (IC) industry has developed rapidly. As the frequency of integrated circuits increasing, electromagnetic interference, thermal effect and mechanical effect from chip level to circuit board are the bottleneck of electronic system performance. Therefore, the multi-physical field simulation of integrated circuit becomes an indispensable part in the design of chip and electronic system. The reliability of the three-dimensional simulation method for the integrated circuit has been recognized, but the computation efficiency cannot be satisfied. The higher-order spectral element method combines the flexibility of the finite element method and the high accuracy of the spectral method becomes a popular method in the numerical simulation of engineering application. Here, we will incorporate the accurate time-domain spectral element method based on Gauss–Lobatto–Legendre polynomials and time-domain finite element method to develop higher order accuracy and efficient method solving the mulitphysics in the integrated circuit. The achievements of this fundamental research should provide a desirable way to improve the precision and efficiency in the calculation for the 3-D integrated circuit and practical theoretical basis for new circuit design.